Context :

3D integration is a rapidly emerging technology that vertically stacks and interconnects multiple materials, technologies, and functional components to form highly integrated micro- and nanosystems for cross-sectorial applications such as medical implantable devices, intelligent sensors, flash memory, computer memory, camera chips, and radio frequency devices in mobile phones. 3D integration is a very promising area of technological development and shows huge economic potential;

The state-of-the-art technology for 3D integration relies on robotic pick-and-place machines and machine vision, which cannot be simultaneously very fast and very accurate. If high precision e.g. a micrometer is needed, the cycle time of the integration can be very long, from e.g. over ten seconds to minutes, or even not achievable.